Dr. Jack Cheng is currently a Professor and Associate Head in Civil and Environmental Engineering, Director of BIM Lab, Director of the RFID Center, and Associate Director of the GREAT Smart Cities Institute at the Hong Kong University of Science and Technology (HKUST). He obtained his PhD degree from Stanford University, in which he started to work on virtual design and construction (VDC) and Construction IT. His research interests include BIM, Internet of Things (IoT), artificial intelligence, laser scanning, construction informatics, robotics, blockchain, construction and facility management, smart and low carbon buildings, and sustainable construction.

He is currently the Chairperson of the Hong Kong Construction Industry Council (CIC) Committee on BIM and Construction Digitalisation, CIC Council Member, Member of CIC Committee on Construction Safety, Chairperson of CITF BIM Vetting Subcommittee, Director of Hong Kong Green Building Council, Past Honorary Treasurer of Hong Kong Institute of Building Information Modeling (HKIBIM), Past President of American Society of Civil Engineers (ASCE) Greater China Section, and Past Chairman of Autodesk Industry Advisory Board (AIAB). He is an Honorary Fellow of the Hong Kong Institute of Civil and Building Information Management (HKICBIM), Professional Member of HKIBIM, CIC Certified BIM Manager (CCBM), CIC Certified BIM Coordinator (CCBC), Certified ISO 19650 Information Manager, and Certified Carbon Auditor Professional (CAP).

He has received the Construction Industry Outstanding Young Person Award in 2019 from the CIC, and a few research and paper awards in international conferences. He is an author of over 250 publications in international journals and conferences.